POLISHER CMP White Pad — Precision from Coarse to Fine
POLISHER White Non-Woven Pad is a key consumable for wafer planarization in Chemical Mechanical Planarization (CMP) processes, engineered with a specially treated non-woven base for high absorbency and uniform material removal.
Key Features:
Role in CMP Process:
Serves as a key consumable for wafer planarization, positioned as the versatile mid-stage solution between coarse polyurethane pads and fine damped fabric pads.
Applications:
Ideal for sapphire, silicon wafer, and copper layer polishing in semiconductor and precision manufacturing — supporting coarse-to-fine processing in a single pad solution.
Certifications: Manufactured under ISO9001 Quality Management System certification.