Double Base Stacked FIn Heatsink IGBT Aluminum Extruded LED Heatsink
Quick Details
| Place of origin | China |
| Grade | 6000 series |
| Temper | T5 |
| Application | Heatsink |
| Branding name | XINYU |
| Processing Service | Cutting,punching,CNC machining |
| Max weidth | 500mm |
| Max height | 200mm |
| Max length | 500mm |
| Shape | Rectangle |
| Alloy or not | Alloy |
| After-sales service | Online support |
| Treatment | Anodizing |
| Standard moulds qty | 30,000sets |
| Certification | RoHS |
Product Description
| Product Name | Double Base Stacked FIn Heatsink IGBT Aluminum Extruded LED Heatsink |
| Material | AL 6063 T5 |
| Detailed Size | As per customers' design,max width 500mm |
| Advantage | Most advanced and lastest technology developed by us;Flexible width, manufactured with low cost molds;Better perormance than bonded fin heatsink; Ideal selection for cooling high power devices |
| Sample Service | Samples with differernt sizes can be availabe for prototypes test within 1 week |
| Production Process | Fins extruding---Fins cutting--Joining fins together---CNC Machining--- Deburring--- Cleaning--- Inspecting--Packing |
| Surface Treatment | Degreasing,(Black) Anodizing,Sand Blasting,Painting,Chromating and Lase r marking |
| Reference Standard | GB/T 3190-2008,GB/T 14846-2008,ISO 2768 |
| Experience | More than 20 years professional manufacturing experience |
| | LED Lighting,Inverter,Welding Machine,Communication Device,Power Supply Equipment,Electronic Industry,Thermoelectric Coolers/Generator,IGBT/UPS Cooling Systems,etc. |
| Main Customers | Vacon,Danfoss |
Pakcaging and Delivery of Heatsink
Package Details:EPE,carton,plywood case or pallet or as per customized
Port:Shanghai
| Quantity(Pieces) | 1 - 10 | >10 |
| Est. Time(days) | 10 | To be negotiated |
How Heatsink works?
A heat sink (also commonly spelled heatsink or called as radiator) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels.