Product Description
Shin Etsu KE-348 is a single component, room-temperature cure, thixotropic adhesive that cures to form a tough, durable elastomer. It is a low odor, neutral cure, noncorrosive product with excellent adhesion to metals, plastics, glass, and ceramics without the need for primers.
Product Introduction
Shin Etsu KE-348 is a high-performance, single-component, room-temperature cure adhesive designed to meet the sealing and bonding needs of industrial and electronic applications. It features thixotropic properties, making it easy to apply and shape, and cures into a tough elastomer. KE-348's low odor and neutral cure characteristics ensure no corrosion to surrounding environments or materials, while its excellent adhesion ensures reliable bonding on various substrates. This adhesive is widely used for sealing electronic devices and forming-in-place gaskets, effectively preventing liquid and gas leaks.
Product Special Attributes
The special attributes of Shin-Etsu KE-348 lie in its outstanding adhesion and versatility. It bonds securely to metals, plastics, glass, and ceramics without primers, making it highly effective in diverse industrial applications. The thixotropic nature of KE-348 makes it easy to handle during application, and it cures into a resilient elastomer with good mechanical and temperature resistance properties. Its mild curing conditions, requiring only 7 days at room temperature, simplify the application process. Additionally, KE-348's excellent electrical insulation properties and stable performance within a wide temperature range (-40°C to +180°C) make it ideal for sealing and insulating electronic devices.
Application scenarios
Shin-Etsu KE-348 is widely used in electronic and industrial fields. In electronic devices, it is used for sealing enclosures, fixing components, and protecting circuits from moisture. KE-348 is also commonly used for form-in-place gaskets to effectively prevent liquid and gas leaks, ensuring the airtightness of equipment. Additionally, it is suitable for sealing and bonding applications in automotive, aerospace, and medical device industries. Its excellent temperature resistance and electrical insulation properties make it an ideal sealing material, capable of meeting the demands of various complex environments.