Simple Attributes
Shin-Etsu KE-45-TS is a one-component, room-temperature curing, thixotropic silicone adhesive that cures to form a tough, durable elastomer. It features low odor, neutral cure, and non-corrosive properties, with excellent unprimed adhesion to metals, plastics, glass, and ceramics.
Product Introduction
Shin-Etsu KE-45-TS cures by moisture in the air, requiring 7 days at 23°C/50% RH for full cure, with a tack-free time of just 6 minutes. It is easy to apply by dispensing or spreading for various electronic and industrial sealing applications.
Parameter Table
Property | Test Method/Conditions | Unit | Value |
---|---|---|---|
Type | - | - | Adhesive/Sealant |
Cure Type | - | - | Condensation |
Number of Components | - | - | One |
Color | Visual | - | Black, White, Gray, Red, Translucent |
Density | @ 23°C | g/cm³ | 1.05 |
Cure Conditions | 7 days @ 23°C/50% RH | - | - |
Tack Free Time | - | min | 6 |
Shore A Hardness | - | - | 30 |
Tensile Strength | - | MPa | 1.90 |
Tear Strength | - | kN/m | 7.00 |
Elongation | - | % | 310 |
Shear Strength | - | MPa | 1.00 |
Volume Resistivity | - | TΩ·m | 10 |
Dielectric Strength | - | kV/mm | 20 |
Dielectric Constant | @ 50Hz | - | 2.6 |
Dielectric Dissipation Factor | @ 50Hz | - | 5×10⁻³ |
Thermal Conductivity | - | W/m·K | 0.21 |
Usable Temperature Range | - | °C | -40 to +180 |
Special Attributes
With a soft 30 Shore A hardness, 310% elongation, and 1.90 MPa tensile strength, it ensures durability in dynamic sealing applications. Its volume resistivity of 10 TΩ·m and dielectric strength of 20 kV/mm make it suitable for electronic insulation. Thermal conductivity is 0.21 W/m·K with a service temperature range of -40°C to +180°C.
Application Scenarios
Shin-Etsu KE-45-TS is designed for form-in-place gasketing and electronics sealing applications, suitable for consumer electronics, automotive electronic modules, and industrial control equipment protection. After research, specific applications of this exact product model include waterproof sealing for smartphone speakers, automotive sensor encapsulation, and LED lighting sealing, but no additional public application data was found for this specific model.
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